Effect of Formate Treatment Time on Ag/Ag Direct Solid State Bond Strength

Shuto BABA; Takaomi KISIMOTO; Sinji KOYAMA

doi:10.1299/jsmemecj.2025.s042p-04

January 1, 2025The Proceedings of Mechanical Engineering Congress JapanOpen Access

Effect of Formate Treatment Time on Ag/Ag Direct Solid State Bond Strength

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Key Points

To investigate how the duration of formate treatment affects the bond strength of Ag/Ag direct solid-state joints.
Analyzed Ag/Ag bond strength over varying formate treatment durations.
Utilized lead-free solders based on Sn-Ag-Cu alloys.
Examined the influence of thermal stress on joint reliability.
Bond strength improves with optimal formate treatment duration.
Lead-free solders exhibit higher melting points and potential thermal stress issues.
Joint reliability may decrease without adequate formate treatment time.

Implication

This research demonstrates the impact of formate treatment on bond strength in lead-free solders, highlighting implications for the electronics industry.

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Cite This Study

BABA et al. (2025) studied this question.

synapsesocial.com/papers/69c4ccd6fdc3bde4489187d0 https://doi.org/10.1299/jsmemecj.2025.s042p-04

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Effect of Formate Treatment Time on Ag/Ag Direct Solid State Bond Strength

Key Points

Implication

Discussion

Cite This Study

Effect of Formate Treatment Time on Ag/Ag Direct Solid State Bond Strength

Key Points

Implication

Discussion

Cite This Study

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