Phonon Thermal Conduction Analysis to Clarify the Effect of Molecule Bond States at the Filler-Resin Interface on Thermal Conduction

Key Points

• The aim is to analyze how molecule bond states at the filler-resin interface affect heat transfer in Thermal Interface Materials.
• Visualized three-dimensional heat conduction across the filler-resin interface.
• Quantified the heat transfer coefficient of the interface experimentally.
• Calculated the heat transfer coefficient using the thermal molecular dynamics method and validated the results.
• Examined the relationship between heat transfer, density, and length of coupling molecules.
• The phonon conduction contributions to the heat transfer coefficient were successfully quantified.
• A clear relationship was found between the heat transfer and the characteristics of the coupling molecules.
• The study validated the thermal molecular dynamics approach in determining effective heat transfer properties.