This article aims to provide an update of the reliability aspects of research on power electronic components and hardware systems. It introduces the latest advances in the understanding of failure mechanisms, testing methods, accumulated damage modeling, and mission-profile-based reliability prediction. Component-level examples (e.g., Si IGBT modules, SiC MOSFETs, GaN devices, capacitors, and magnetic components) are used for illustration purposes in addition to system-level studies. The limitations and associated open questions are discussed to identify future research opportunities in power electronics reliability.
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Wang et al. (2020) studied this question.
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