Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

David Speed; Paul Westerhoff; Reyes Sierra‐Álvarez; Rockford K. Draper; Paul Pantano; Shyam Aravamudhan; Kai Loon Chen; Kiril Hristovski; Pierre Herckès; Xiangyu Bi; Yu Yang; Chao Zeng; Lila Otero-González; Carole Mikoryak; Blake A. Wilson; Karshak Kosaraju; Mubin Tarannum; Steven Crawford; Yi Peng; Xitong Liu; S. V. Babu; Mansour Moinpour; James F. Ranville; Manuel D. Montaño; Charlie Corredor; Jonathan D. Posner; Farhang Shadman

doi:10.1039/c5en00046g

Ask about this paper

Answers are grounded in this paper and cite their sources.

Abstract

This tutorial review focuses on aqueous slurries of dispersed engineered nanoparticles (ENPs) used in chemical mechanical planarization (CMP) for polishing wafers during manufacturing of semiconductors.

Discussion

No takes yet. Share an insight, caveat, or question.

Cite This Study

Speed et al. (2015) studied this question.

synapsesocial.com/papers/69d730ec8e958094d1b8a342 https://doi.org/10.1039/c5en00046g

View at Publisher

Ask AI

Bookmark

Share

Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

Ask about this paper

Abstract

Discussion

Cite This Study

Physical, chemical, and in vitro toxicological characterization of nanoparticles in chemical mechanical planarization suspensions used in the semiconductor industry: towards environmental health and safety assessments

Ask about this paper

Abstract

Discussion

Cite This Study

Keep reading

Keep reading