In this paper, we present a method to characterize differential via holes in printed circuit boards in a both fast and accurate way. The via hole is modeled as a cascade of capacitances and inductances. We use FASTCAP to compute the values of the capacitances, and a closed form formula to obtain the inductance values. The numerical predictions are compared with experimental data.
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Laermans et al. (2001) studied this question.
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