In the present study, the possibility of nickel deposition from a deep eutectic solvent on a water-sensitive substrate like aluminium was investigated. The electrolyte used was based on a 1:2 molar mixture of choline chloride and urea with the addition of nickel chloride to provide nickel ions and ethylendiammine (ED) to complex. The deposition from the solution described having 1:2 as a Ni/ED molar ratio gave interesting results in terms of adhesion to aluminium and uniformity of the deposition. The electrochemical study of the solution is provided. Application of electrodeposited Watt's nickel and electroless NiP was also attempted on the layers from ionic liquid. The morphological characterisation proved the quality of the layers, while a corrosion study demonstrated the protective properties of the coatings obtained.
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Bernasconi et al. (2016) studied this question.
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