Stress-Modulated Structural and Electronic Evolution in Metals with Different Crystal Structures

While macroscopic stress significantly impacts the performance of metallic components, the underlying atom–electron coupling mechanisms governed by distinct crystal symmetries remain insufficiently understood. To address this gap, this work systematically investigates the structural and electronic evolution of representative metallic materials under applied stress. Experimentally, X-ray diffraction (XRD) revealed complex macroscopic residual stress distributions in cold rolled titanium alloy and silicon steel. Motivated by these engineering observations, first-principles density functional theory (DFT) calculations were conducted to uncover the underlying physical mechanisms. Specifically, the responses of face-centered cubic (FCC) aluminum and copper, body-centered cubic (BCC) iron, and hexagonal close-packed (HCP) titanium crystals were investigated under tension and compression using the RPBE functional. Stress-dependent elastic properties, density of states (DOS), band structures, and phonon spectra were calculated. Results show that tension softens all metals (Al becomes mechanically unstable), whereas compression stiffens their lattices. Electronically, tensile loading sharpens DOS peaks near the Fermi level and shifts conduction bands closer to it, whereas compression smooths DOS peaks and shifts bands away. Phonon analysis indicates Cu and Ti remain dynamically stable, while Al and Fe exhibit phonon mode softening under high tension. These stress-induced changes highlight crucial atom–electron coupling mechanisms, providing a theoretical basis for tailoring metallic performance via stress engineering.