Three-dimensional integrated circuit (3D IC) packaging and heterogeneous integration have emerged as central pillars of contemporary semiconductor scaling. Yet, the multi-physics coupling inherent to stacked architectures manifesting as thermal hot spots, warpage-induced stresses, and interconnect aging demands monitoring and control capabilities that surpass traditional offline metrology. Although Digital Twin (DT) technology provides a principled route to real-time reliability management, the existing literature remains fragmented and frequently blurs the distinction between static multi-physics simulation workflows and truly dynamic, closed-loop twins. This critical review addresses these deficiencies through three main contributions. First, we clarify the Digital Twin hierarchy to resolve terminological ambiguity between digital models, shadows, and twins. Second, we synthesize three foundational enabling technologies. We examine physics-based modeling, emphasizing the shift from finite-element analysis (FEA) to real-time surrogates. We analyze data-driven paradigms, highlighting virtual metrology (VM) for inferring latent metrics. Finally, we explore in situ sensing, which serves as the “nervous system” coupling the physical stack to its virtual counterpart. Third, beyond a descriptive survey, we outline a possible hybrid DT architecture that leverages physics-informed machine learning (e.g., PINNs) to help reconcile data scarcity with latency constraints. Finally, we outline a standards-aligned roadmap incorporating IEEE 1451 and UCIe protocols to support the transition from passive digital shadows toward more adaptive and fully coupled Digital Twin frameworks for 3D IC manufacturing and field operation.
Datta et al. (Mon,) studied this question.