ABSTRACT Hydrogel‐based flexible circuits demand robust rigid‐soft interfacial adhesion, strain‐insensitive electrical performance, and reliable digital‐analog signal transmission capabilities to enable high‐performance electronic skin (e‐skin) applications. Here, we developed a 3D‐printable AgNSs/AA‐DMAPS hydrogel with tunable viscosity via a dual‐anchoring strategy, where silver nanosheets (AgNSs) create nano‐adhesion by forming dynamic crosslinked hydrogel networks. The resulting hydrogel exhibits strain insensitivity within 500% elongation, high electrical conductivity (>16 × 10 4 S/m), and superior multi‐interfacial adhesion properties. Notably, the dual‐anchoring design enables dynamic bonding with metal surfaces (∼450 kPa), allowing self‐welding to hardware without treatment. Flexible circuits printed with AgNSs/AA‐DMAPS hydrogel demonstrate near‐field communication (NFC) functionality and wireless charging, with flexible printed circuit (FPC) capable of transmitting high‐speed signals up to 8 MHz while maintaining effective image signal transmission under 50% strain. Our printed brain‐computer interface (BCI) e‐skin based on this hydrogel achieves EEG signal monitoring. In consciousness classification tasks using the BCI e‐skin, our proposed CNN‐LSTM model attained 90.8% accuracy across six categories. The classification system was deployed on a local server to drive robotic manipulation, enabling real‐time EEG‐controlled robotic hand movement through locally models. The AgNSs/AA‐DMAPS hydrogel‐based BCI e‐skin opens new possibilities for daily brain monitoring applications and continuous exploration of neuropsychiatric disease progression patterns.
Li et al. (2026) studied this question.