Special issue presents advances in microwave and THz devices for communication and sensing applications, indicating promising technological developments.
The special issue collects 13 papers presenting recent advances in the measurement, modeling, and simulation of microwave and terahertz devices for communication and sensing applications. The contributions discuss electromagnetic material characterization, microwave and THz devices for biomedical and healthcare applications, and component design for IoT, wearable, and biomedical technologies. Novel modeling and measurement techniques are also introduced, with an emphasis on linear and nonlinear approaches for accurate calibration. The application of artificial intelligence and machine learning in model development and validation is also explored, alongside the design, simulation, and performance analysis of high‐frequency circuits and systems. These articles highlight current progress and emerging directions in the modeling, characterization, and application of high‐frequency technologies.
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Bao et al. (2026) studied this question.
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