In this study, TiO2 nanotube (TNTs) array electrodes were fabricated by electrochemical anodization and subsequently modified through thermal annealing, hydrogenation heat treatment, and chemical decoration with copper species at various immersion times to enhance their electrochemical performance. The structural, morphological, semiconducting, and electrochemical properties of the modified nanotubes were systematically examined. FE-SEM and EDS analyses confirmed the formation of well-aligned TNTs and the successful deposition of copper species, with the most uniform surface distribution achieved for the sample decorated for 45 min. Raman spectroscopy and XRD results revealed that the anatase phase of TiO2 remained stable after hydrogenation and copper decoration, while minor peak shifts indicated defect evolution and lattice distortion. Electrochemical evaluations, including linear sweep voltammetry, Tafel polarization, electrochemical impedance spectroscopy, and Mott–Schottky analysis, demonstrated a substantial enhancement in electrocatalytic activity following copper decoration. Compared with annealed and hydrogenated electrodes, the decorated samples exhibited markedly lower overpotentials, reduced cathodic Tafel slopes, and decreased charge-transfer resistance. Mott–Schottky analysis confirmed n-type semiconducting behavior for all electrodes, showing that hydrogenation increased donor density, whereas subsequent copper decoration slightly reduced it due to the partial substitution of oxygen vacancies by copper oxide species. Among all samples, the electrode decorated for 45 min (AA′HD45) exhibited the optimal balance between donor density, charge-transfer properties, and electrochemical performance. These results highlight the effectiveness of combining hydrogenation with optimized copper decoration to improve charge transport and interfacial kinetics in TNT electrodes for electrochemical applications.
Namdar-Asl et al. (2026) studied this question.