ohm/sq surface resistivity and the highest tensile strength, elongation at break and modulus of 29.3 ± 2.4 MPa, 60.1 ± 1.6% and 1364.0 ± 85.2 MPa respectively. Hence, PAni is a good candidate to be used in PLA/PAni systems by giving a suitable surface resistivity that can potentially be applied in anti-static packaging applications.
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Wong et al. (2020) studied this question.
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