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Demonstrates TaC filtration improves crystalline quality and reduces carbon inclusions in SiC, suggesting enhanced semiconductor manufacturing methods.
The presence of carbon inclusions, originating from the nonstoichiometric sublimation of source materials, poses a significant challenge to the quality of silicon carbide (SiC) single crystals grown by the physical vapor transport (PVT) method. To address this issue from a metallurgical process control perspective, this study investigates the application of a filtration structure based on tantalum carbide (TaC). TaC particles were synthesized, and their interfacial evolution during the crystal growth environment was systematically characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS). Results revealed that carbon is progressively adsorbed onto the TaC particles, forming a surface layer. Crucially, the filtration performance is closely related to the surface state of the TaC. Under improper growth conditions, excessive carbon thickening turns the surface from golden-yellow to black-gray, severely impairing its adsorption capacity. Density functional theory (DFT) calculations corroborate that golden-yellow TaC exhibits a markedly higher carbon adsorption energy (−1.46 eV) than its black-gray state counterpart (−0.82 eV). Crystal growth experiments further demonstrate that maintaining TaC in the golden-yellow state enables stable dynamic filtration during 4H-SiC growth. The resulting 4H-SiC wafers exhibit excellent polytype stability, high crystalline quality, ultralow carbon inclusion density, and extremely low dislocation density. These results confirm the practical feasibility of TaC-based filtration for high-quality, low-defect SiC substrate fabrication. This work not only provides an effective strategy for defect control in SiC crystal growth but also clarifies the underlying mechanisms─specifically, the structure–activity relationship of TaC and its interfacial interaction with C during high-temperature vapor-phase adsorption─thus advancing its practical application in advanced semiconductor material preparation.
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Wang et al. (2026) studied this question.
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