Dual‐Field Synergistic Orientation of Carbon Fibers for High‐Efficiency Thermal Management

Modern electronic components are trending toward miniaturization and high‐power‐density, which leads to the accumulation of heat and causes thermal‐induced functional failure. To address this challenge, the development of efficient thermal interface materials (TIMs) as the thermal bridge between the heat source and heat sink has become essential. However, fabricating high‐performance TIMs by achieving precise alignment of mesophase pitch‐based carbon fibers (MPCF) with exceptionally high axial thermal conductivity remains a significant technical challenge. In this study, we develop a dual‐field strategy that synergistically combines reversing electric and low magnetic fields (0.2 T) to fabricate highly aligned carbon fiber (CF)‐based TIMs. A photocurable gel was employed as the polymer matrix to improve the efficiency of composite fabrication. The resulting composite exhibits an excellent through‐plane thermal conductivity as high as 84.88 W m −1 K −1 at 35 wt% CF loading. By addressing the limited alignment precision of the conventional electrostatic flocking techniques, this work provides a novel insight into designing high‐performance TIMs with vertically aligned CF, demonstrating great potential for advanced thermal management applications.