Investigation of wavy microchannel ability on electronic devices cooling with the case study of choosing the most efficient microchannel pattern

and for the most efficient wavy and straight microchannels. Results showed that the geometries with larger amplitude to wavelength ratio have a lower radius of curvature and larger Dean number, and as a result of transverse flow (secondary flow) amplification, they have enhanced heat transfer. Also, by comparing the ratio of the transverse velocity components to the axial component, it was found that by decreasing the radius of curvature and increasing the Dean number, transverse velocity increases, which intensifies the heat transfer between the wall and the fluid. The appraisement of the performance evaluation criterion (PEC) illustrates that the wavy case with an amplitude of 250 μm and wavelength of 2500 μm is the best geometry from the thermal-hydraulic point of view in the studied range. Finally, with variable flux condition, the wavy microchannel has responded well to the temperature increase and has created a much more uniform surface temperature compared to straight pattern. The proposed wavy pattern ensures that there are no hotspots which could damage the electronic chip. Presented wavy patterns can be used in heat sinks heat transfer enhancement to allow the chip to run in higher heat fluxes.