One of the exciting and promising developments in material science today is the design and synthesis of novel low‐dielectric‐constant polymer materials, which are found to have potential applications in the field of ultralarge‐scale integration, capacitors and other electronic circuits as insulating and/or dielectric materials. In this article the new polymer dielectric materials reported in recent years are reviewed, including aromatic (heteroaromatic) polymers, silicon‐containing polymers, fluorinated polymers, porous polymers, etc. In summarizing the review, the development, potential applications and future directions of polymer materials with low dielectric constant are discussed.
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Zhao et al. (2010) studied this question.
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