Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

The ability to measure the adhesion energy of metal thin films on polymer substrates is important for the design of reliable flexible electronic devices. One technique is to create well-defined areas of delamination (buckles) as a consequence of lateral compressive stresses induced by tensile straining of the film–substrate system. The adhesion energy is calculated from the buckle dimensions. In order to improve the adhesion between the metal film and polymer substrate, thin adhesion layers can be incorporated. However, interdiffusion and reactions can occur between the adhesion layer and the metal film when subjected to elevated temperatures. This is detrimental for the interfacial adhesion, as will be discussed for Cu films on polyimide with a Ti interlayer subjected to annealing at 350°C.