Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide–EMC, Polyimide–SiO2, and Silicon–EMC) Found in Microchips

-PI's fracture energy at high temperature was 42% less than that of EMC-Si. The PI-EMC interface exhibited nearly double the crack growth rate compared to EMC-Si. The findings of this study provide valuable insights into the fracture behavior of bi-material interfaces, offering practical applications for improving the reliability and design of semiconductor devices, especially in chip packaging.