DRAM scaling has been the prime driver for increasing the capacity of main memory system over the past three decades. Unfortunately, scaling DRAM to smaller technology nodes has become challenging due to the inherent difficulty in designing smaller geometries, coupled with the problems of device variation and leakage. Future DRAM devices are likely to experience significantly high error-rates. Techniques that can tolerate errors efficiently can enable DRAM to scale to smaller technology nodes. However, existing techniques such as row/column sparing and ECC become prohibitive at high error-rates.
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Nair et al. (2013) studied this question.
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