Thermomechanical and electroactive behavior of a thermosetting styrene‐based carbon black shape‐memory composite

A thermosetting styrene‐based shape memory polymer (SMP) filled with nanoscale (30 nm) carbon black are prepared to reinforce the thermomechanical performances and realize the high‐efficient electronic actuation at macro scale due to the carbon–carbon network morphology at nano/micro scale. The elastic modulus of this thermosetting SMP composite is significant strengthened and can maintain at 1–2.5 GPa at around the room temperature, which is suitable for used as a structural material. The electronic resistivity decreases sharply at a quite low percolation threshold range (2–5%), and maintains at a relatively low and stable level of electronic resistivity. Furthermore, the electronic resistivity also exhibits relative stability in terms of the resistivity–temperature–time relationship and the evolution of resistivity upon heating–cooling cycles. This shape memory styrene‐based composite is suitable to be used as an electroactive functional material in realistic engineering.