Soft stretchable thick–thin-film devices are prepared by merging different fabrication technologies with different functional materials. The new “island–bridge” devices rely on screen-printed thick-film island electrodes, connected by thin-film serpentine interconnects. Such a hybrid fabrication process enables to realize high-performance stretchable materials toward a new class of soft electronics with new capabilities that cannot be achieved via individual fabrication routes.
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Mohan et al. (2017) studied this question.
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