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May 20, 2026Journal of Surface Investigation X-ray Synchrotron and Neutron Techniques0 citations

Void Swelling Enhancement Near Grain Boundaries Driven by the Production Bias

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АСА. А. СеменовEKE. A. Koptelov

Key Points

  • The study investigates the mechanism behind enhanced void swelling near grain boundaries due to vacancy production bias.
  • Analytical discussion of vacancy emission and primary vacancy clusters affecting interstitial clusters.
  • Consideration of thermal behavior and spatial heterogeneity near grain boundaries.
  • Enhanced void swelling occurs near grain boundaries due to the imbalance of interstitial outflow and inflow.
  • This mechanism operates without the necessity of dislocation bias or long-range transport of small interstitial clusters.

Abstract

At elevated temperatures, vacancy emission from thermally unstable primary vacancy clusters (PVCs) leads to the shrinkage of the overwhelming majority of primary interstitial clusters (PICs) also produced in collision cascades. Sessile PICs shrinking below a certain minimum size become mobile. In a spatially heterogeneous case, an exact balance between their outflow from any finite volume and the corresponding inflow from adjacent spatial regions is not necessarily maintained, which is particularly important near grain boundaries. The excess of vacancies caused by the net interstitial outflow from a certain volume leads to enhanced void swelling in this volume. In this case, neither the conventional dislocation bias nor the long-range transport of small PICs by one-dimensional glide along close-packed atomic directions is required. This work analyzes and discusses the operation of this mechanism of enhanced void swelling in regions adjacent to grain boundaries.

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Cite This Study

Семенов et al. (2025) studied this question.

synapsesocial.com/papers/6a0d5122f03e14405aa9d72dhttps://doi.org/10.1134/s1027451026700023
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