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SU-8 has become the favourite photoresist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability. However, as feature sizes get smaller and pattern complexity increases, particular difficulties and a number of material-related issues arise and need to be carefully considered. This review presents a detailed description of these effects and describes reported strategies and achieved SU-8 HAR and 3D structures up to August 2006.
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Campo et al. (2007) studied this question.
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