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November 11, 2002

Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies

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Authors

PZP. ZürcherON Semiconductor (United States)PAP. AlluriOracle (United States)PCPeir-Yung ChuMotorola (United States)

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Zürcher et al. (2002) studied this question.

synapsesocial.com/papers/6a1266bc8edbaba0bf672ed5https://doi.org/10.1109/iedm.2000.904281
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