Metallic Micro-Pillared Heat-Radiation Device with Higher IR-Emissivity

Metallic micro-textures were regularly aligned onto the copper sheet by the lithographic and wet plating processes. The resin film with the regularly aligned through-holes was first formed onto the copper specimen using the lithographic treatment. Nickel-base micro-pillars were formed by selective nucleation and growth into these through-holes. This micro-pillared device with regular alignment was characterized by thermographic microscopy with FTIR to investigate the effect of regularity control on the IR-emittance. Heat radiation experiment in vacuum was performed to describe the IR-radiation from the regularly micro-pillared device to a target plate. Nanotexturing effect onto this microtextured device was further investigated by comparison of IR-emission spectra for micro-pillared copper device with and without nanotextures via wet plating.