December 1, 2016

Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding

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Resumen

We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable results.

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Kagawa et al. (Thu,) studied this question.

synapsesocial.com/papers/6a12e9b392637892a9a77e10 https://doi.org/https://doi.org/10.1109/iedm.2016.7838375

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