Multi-Objective Optimization of Microstructures Embedded in MCHS for Enhancing Thermal Management of Electronic Components

Microelectronics dissipate more heat as their performance and functionality improve. MCHS has been considered one of the prominent techniques for the cooling of microelectronic components, where higher heat removal can be achieved by integrating microstructures into MCHS and optimizing channel geometry. A novel configuration of microstructures in a horizontal cylindrical shape integrated in different patterns has been extensively investigated to compare the thermohydraulic and thermodynamic performance of conventional vertical micro-pillars and novel horizontal micro-pillars. Numerical study has been carried out employing commercial CFD code “ANSYS Fluent” for the simulation of the different configurations of horizontal micro-pillars and vertical micro-pillars for Reynolds numbers spanning from 300 to 740. Fluid flow characteristics and temperature field distribution have been examined to understand the effect of flow behaviour on the cooling performance of microchannels. Alternating horizontal micro-pillars and vertical micro-pillars results in a comprehensive high cooling performance where both normalwise secondary flow and spanwise secondary flow are obtained. Multi-objective optimization has been employed to provide optimal micro-pillar dimensions and patterns. Increased temperature uniformity and enhanced entropy generation are obtained through the integration of the novel configuration of horizontal micro-pillars into MCHS.