Electrolytic deposition of metals on to the high-voltage contact in an electrospray emitter: implications for gas-phase ion formation

The electrospray ion source is an electrolytic flow cell. Electrolytic reactions in the electrospray emitter maintain the production of charged droplets by this ion source that contain an excess of ions of one polarity. These redox reactions necessarily change the composition of the solution that initially enters the emitter. As a result, the ions ultimately observed in the gas phase by electrospray mass spectrometry (ESMS) may be substantially influenced by both the nature and extent of these electrochemical reactions. It is demonstrated in this paper that Ag(+), Cu(2+) and Hg(2+) ions in solution can be electrolytically reduced and deposited as the respective metals on to the surface of the high-voltage contact in the electrospray emitter in negative ion mode electrospray. The deposited metals are shown to be liberated from the surface by switching the electrospray high-voltage polarity to operate in the positive ion mode. The deposited metals are oxidized in positive ion mode, releasing the metal ions back into solution where they are detected in the electrospray mass spectrum. In a semi-quantitative analysis, it was found that up to 50% of the Ag(+) in a 2.5 microM solution was deposited on the high-voltage contact of the emitter as the solution flowed through the emitter. Deposition of Cu(2+) and Hg(2+) was less efficient. These data illustrate that in the analysis of metals by ESMS, one must be aware that both the concentration and form of the metals may be altered by electrochemical processes in the emitter. Hence reduction or oxidation of metals in the electrospray emitter, which may remove ions from solution, or change metal valence, would be expected to impact both quantitative metal determinations and metal speciation attempts using ESMS.