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Investigates the dual effect of In addition on IMC growth and shear properties in solder joints, suggesting important implications for high-temperature reliability.
In the field of chip packaging, the excessive growth of interfacial intermetallic compounds (IMC) in solder joints during high-temperature aging has become a critical reliability concern. To investigate the effect of In addition on the high-temperature aging reliability of Sn-0.7Cu-0.8Zn/Cu solder joints, this study comparatively analyzed the IMC growth behavior and shear property evolution at the interface of Sn-0.7Cu-0.8Zn and Sn-0.7Cu-0.8Zn-3.5In solder joints during isothermal aging at 160 °C. The results indicate that In addition exhibits a dual effect on IMC growth: it suppresses IMC growth in the as-soldered condition, but promotes IMC growth after aging, increasing the growth rate coefficient from 0.09 μm/h 1/2 to 0.26 μm/h 1/2 . In atoms exist in solid solution within the IMC and β-Sn phases, generating a solution strengthening effect, while also leading to a more uniform distribution of IMC grains and a more stable Cu 6 Sn 5 phase. Shear performance tests reveal that the addition of In improves the shear strength of the solder joints by approximately 2 MPa at all aging times; however, the fracture mode transitions from ductile fracture in the solder matrix to mixed solder/IMC fracture. Considering both IMC growth behavior and shear property evolution, the addition of 3.5 wt.% In demonstrates a significant effect in enhancing the post-aging shear performance of Sn-0.7Cu-0.8Zn/Cu solder joints.
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Wu et al. (2026) studied this question.
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