Monolithic 3-D (M3D) technology enables unprecedented degrees of integration on a single chip. The miniscule monolithic intertier vias (MIVs) in M3D are the key behind higher transistor density and more flexibility in designing circuits compared to conventional through silicon via (TSV)-based architectures. This article presents a comprehensive design and test techniques for emerging M3D-enabled circuits and systems.
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Chaudhuri et al. (2020) studied this question.
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