A D&T Roundtable: Testing Mixed Logic and DRAM Chipshigher throughput devices has put the integration of DRAM into a new spectrum.]

The ability to increase the bandwidth and number of I/Os from embedded DRAMs and to support 3D graphics and higher throughput devices has put the integration of DRAM into a new spectrum. Because of their impact on process technology and test, these devices present us with several new challenges. At a November 1997 roundtable, experts from a variety of specialties explored test impacts and the challenges ahead.