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Sensors are widely used in modern technology, but their increasing integration into critical systems makes them vulnerable to intentional electromagnetic interference (IEMI). High-power electromagnetic (HPEM) attacks can disrupt sensor functionality without physical access, raising concerns about their impact on system reliability. This study investigates the susceptibility of sensors to IEMI and evaluates different countermeasures, including shielding, Printed Circuit Board (PCB) modifications, and electromagnetic absorbers. Results confirm that PCB lines act as primary coupling paths, but the sensor chip itself remains vulnerable. While shielding and PCB modifications offer strong protection, their practicality in real-world applications is limited. Absorbers provide a more feasible alternative, though their effectiveness depends on material properties, placement, and frequency. Some absorbers also introduce unintended effects, such as thermal influence and increased system crashes. The findings emphasize the complexity of IEMI protection and the need for further research to develop cost-effective and adaptable mitigation strategies for sensor-based systems.
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Lavau et al. (2025) studied this question.