Screening Surface Structure–Electrochemical Activity Relationships of Copper Electrodes under CO₂ Electroreduction Conditions

evolution is dominant to high-index facets where more reaction intermediates are expected. This approach allows the acquisition of 2500 voltammograms on approximately 60 different Cu surface facets identified with EBSD. The results show that the order of activity is (111) < (100) < (110) among the Cu primary orientations. The collection of data over a wide range of secondary orientations leads to the construction of an "electrochemical-crystallographic stereographic triangle" that provides a broad comprehension of the trends among Cu secondary surface facets rarely studied in the literature, [particularly (941) and (741)], and clearly shows that the electroreduction activity scales with the step and kink density of these surfaces. This work also reveals that the electrochemical stripping of the passive layer that is naturally formed on Cu in air is strongly grain-dependent, and the relative ease of stripping on low-index facets follows the order of (100) > (111) > (110). This allows a procedure to be implemented, whereby the oxide is removed (to an electrochemically undetectable level) prior to the kinetic analyses of electroreduction activity. SECCM screening allows for the most active surfaces to be ranked and prompts in-depth follow-up studies.