Fundamentals and Cutting-Edge Technologies of Semiconductor Chiplets

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Key Points

The study aims to clarify the role of chiplet technologies in packaging design and process development while identifying future challenges in the field.
Reviewed fundamental and cutting-edge chiplet technologies
Analyzed micro bump bonding techniques and interconnect performance
Discussed advancements in ultra-fine pitch connections
Micro bump bonding is widely used for chiplet interconnections but has limitations regarding implementation density and thermal conductivity.
Recent developments in ultra-fine pitch connections of less than 20 μm have emerged, emphasizing the need for improved alignment precision.
Challenges related to parasitic capacitance and void formation in chiplet assemblies persist.

This review examines semiconductor chiplet technologies, aiming to clarify their role in packaging design and highlight future challenges.

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Takeshi TAKAGI (2025) studied this question.

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