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The study aims to clarify the role of chiplet technologies in packaging design and process development while identifying future challenges in the field.

June 3, 2026Journal of The Surface Finishing Society of Japan0 citationsOpen Access

Fundamentals and Cutting-Edge Technologies of Semiconductor Chiplets

TTTakeshi TAKAGI

Key Points

The study aims to clarify the role of chiplet technologies in packaging design and process development while identifying future challenges in the field.
Reviewed fundamental and cutting-edge chiplet technologies
Analyzed micro bump bonding techniques and interconnect performance
Discussed advancements in ultra-fine pitch connections
Micro bump bonding is widely used for chiplet interconnections but has limitations regarding implementation density and thermal conductivity.
Recent developments in ultra-fine pitch connections of less than 20 μm have emerged, emphasizing the need for improved alignment precision.
Challenges related to parasitic capacitance and void formation in chiplet assemblies persist.

Abstract

これらの技術が今後のパッケージング設計・プロセス開発に果たす役割を明確化し，表面技術分野における今後の課題と展望を提示する。 2 ．チップレット実装を支える要素技術 (基礎編) 2．1 マイクロバンプ接合技術チップレット間の接続には，従来よりマイクロバンプ (micro bump) によるフリップチップ実装が広く用いられてきた。一般に Cu ピラー上に Sn 系はんだを形成し，熱圧着によって接合する構造が採られる。バンプピッチは 40～100 μm 程度が主流であり，通信帯域に対して十分なインターコネクト性能を確保できるが，実装密度や寄生容量，熱伝導の観点では限界が指摘されている。近年ではピッチ 20 μm 以下の超微細接合も開発されているが，バンプのアライメント精度，ボイド半導体チップレットの基礎と最先端技術高

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Takeshi TAKAGI (2025) studied this question.

synapsesocial.com/papers/6a1fc3c1dee9eb8c0dce54e9 https://doi.org/10.4139/sfj.76.544

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June 3, 2026Journal of The Surface Finishing Society of Japan0 citationsOpen Access

Fundamentals and Cutting-Edge Technologies of Semiconductor Chiplets

TTTakeshi TAKAGI

Key Points

The study aims to clarify the role of chiplet technologies in packaging design and process development while identifying future challenges in the field.
Reviewed fundamental and cutting-edge chiplet technologies
Analyzed micro bump bonding techniques and interconnect performance
Discussed advancements in ultra-fine pitch connections
Micro bump bonding is widely used for chiplet interconnections but has limitations regarding implementation density and thermal conductivity.
Recent developments in ultra-fine pitch connections of less than 20 μm have emerged, emphasizing the need for improved alignment precision.
Challenges related to parasitic capacitance and void formation in chiplet assemblies persist.

Abstract

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Cite This Study

Takeshi TAKAGI (2025) studied this question.

synapsesocial.com/papers/6a1fc3c1dee9eb8c0dce54e9 https://doi.org/10.4139/sfj.76.544

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