PulseTrendingJournal ClubResearchersJournalsExplore
Instagram
HomeTrendingJournal ClubExplore
Synapse
⌘+K
Synapse
June 3, 2026Journal of The Surface Finishing Society of JapanOpen Access

Devise Embedded Substrate for Miniaturization and High Functionality of Electronic Devices

View Full Paper
Ask AI
Bookmark
Share

Authors

YKYoshihisa Katoh

Discussion

Loading...

Member takes

Overview

Randomized trial evaluates functionality improvements in electronic devices using embedded substrates, suggesting advancements in semiconductor design.

Key Points

  • This research aims to explore the advancements in embedded substrate technology for enhancing electronic device functionality and miniaturization.
  • Investigated 3D integration forms, focusing on embedded technology in printed wiring boards.
  • Studied functionalities of active and passive components incorporated in electronic substrates.
  • Reviewed international standardization efforts related to embedded substrate techniques.
  • Improved miniaturization and reliability of electronic devices through embedded substrate technology.
  • Enhanced high-frequency characteristics indicated by the successful integration of various active and passive components.
  • Contributes significantly to the development of IoT technology and high-performance electronics.

Cite This Study

Yoshihisa Katoh (2025) studied this question.

synapsesocial.com/papers/6a1fc40fdee9eb8c0dce59dchttps://doi.org/10.4139/sfj.76.587
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Recent Surface Finish Technology Leads Next Gen. Chiplets Era2025
  2. 2Fundamentals and Cutting-Edge Technologies of Semiconductor Chiplets2025
  3. 3Current Advances and Outlook of Advanced Packaging2025 · 6 citations
  4. 4Next Generation Heterogeneous 3D IC Chip Packaging2024
  5. 5Micro-3D-Printed Packaging Substrates With Embedded Through Holes for Organic Interposers2024