Flexible infrared photodetectors are key building blocks for next-generation sensing systems demanding mechanical compliance, lightweight form factors, and seamless integration with conventional platforms. We review recent progress in infrared-sensitive materials, strain engineering strategies, fabrication processes, and device architecture that enable high performance under mechanical deformation. Key application domains and emerging research directions toward scalable, robust, and application-ready flexible infrared photodetectors are outlined, offering a forward-looking roadmap for the field.
Balendhran et al. (Mon,) studied this question.