Population
Isotropic conductive adhesive bonds from three suppliers
Comparison
Thermo-cycling and mechanical stress vs Nondegraded or slightly cycled bonds
Design
Other
Key result
Noise analysis under mechanical stress on nondegraded or slightly cycled conductive adhesive bonds is a fast diagnostic tool for reliability characterization.
Authors
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May accelerate bond reliability screening in devices; leaves open clinical validation before adoption.
Noise analysis under mechanical stress can serve as a fast diagnostic tool for reliability characterization of conductive adhesive bonds.
Brorson et al. (1978) studied Arterial hypertension (per title). Thermo-cycling and mechanical stress was evaluated on 1/f noise of the contact resistance. Noise analysis under mechanical stress on nondegraded or slightly cycled conductive adhesive bonds is a fast diagnostic tool for reliability characterization.