On thermal effects in deep sub-micron VLSI interconnects

Article Free Access Share on On thermal effects in deep sub-micron VLSI interconnects Authors: Kaustav Banerjee Integrated Systems, Department of Electrical Engineering, Stanford University, Stanford, CA and Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA Integrated Systems, Department of Electrical Engineering, Stanford University, Stanford, CA and Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CAView Profile , Amit Mehrotra Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CAView Profile , Alberto Sangiovanni-Vincentelli Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CAView Profile , Chenming Hu Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CAView Profile Authors Info & Claims DAC '99: Proceedings of the 36th annual ACM/IEEE Design Automation ConferenceJune 1999Pages 885–891https://doi.org/10.1145/309847.310093Published:01 June 1999Publication History 60citation1,225DownloadsMetricsTotal Citations60Total Downloads1,225Last 12 Months111Last 6 weeks22 Get Citation AlertsNew Citation Alert added!This alert has been successfully added and will be sent to:You will be notified whenever a record that you have chosen has been cited.To manage your alert preferences, click on the button below.Manage my AlertsNew Citation Alert!Please log in to your account Publisher SiteeReaderPDF