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May 1, 1994IEEE Transactions on Electron Devices540 citations

Hole injection SiO/sub 2/ breakdown model for very low voltage lifetime extrapolation

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KSK.F. SchuegrafCHChenming Hu

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Abstract

In this paper, we present a model for silicon dioxide breakdown characterization, valid for a thickness range between 25 /spl Aring/ and 130 /spl Aring/, which provides a method for predicting dielectric lifetime for reduced power supply voltages and aggressively scaled oxide thicknesses. This model, based on hole injection from the anode, accurately predicts Q/sub BD/ and t/sub BD/ behavior including a fluence in excess of 10/sup 7/ C/cm/sup 2/ at an oxide voltage of 2.4 V for a 25 /spl Aring/ oxide. Moreover, this model is a refinement of and fully complementary with the well known 1/E model, while offering the ability to predict oxide reliability for low voltages.>

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Cite This Study

Schuegraf et al. (1994) studied this question.

synapsesocial.com/papers/6a2075e9a40bcbc79e0996e6https://doi.org/10.1109/16.285029
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