Historically, high-performance logic circuit interchip design has focused on bipolar emitter-coupled logic (ECL) circuits and signals, but VLSI CMOS has attained performance levels at which problems unique to its characteristics must be addressed for design optimization. In this paper, CMOS interchip circuit models are applied to develop packaging and wiring constraints for synchronous communication.
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R. F. Sechler (1995) studied this question.
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