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A multiscale method that allows a noninvasive and precise integration of thousands of nano- or microscale electronic devices into large macroscopic materials or structures of any 3D shape and rigidity is demonstrated. An array of microsensors (for strain and temperature) is built on a spider-web-like, highly expandable and flexible polyimide substrate that is engineered in such a way as to allow unique area dilatations. © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Lanzara et al. (Tue,) studied this question.
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