Development of Thermally Stable Polyamide through Integration with Oxirane Functional Graphene

This study investigates the thermal stabilization of aromatic polyamides via oxirane‐functionalized graphene linkers. Epoxidized graphene oxide (EpGO) was incorporated into polyamides synthesized through polycondensation of terephthaloyl chloride (TCL) or isophthaloyl chloride (ICL) with 4,4‐diaminodiphenylmethane (DDM). Graphene oxide (GO) was prepared via modified Hummer's method and subsequently functionalized with glycidyl methacrylate through AIBN‐initiated polymerization. Comprehensive characterization employed FT‐IR, NMR, SEM, and TG‐DTA‐DTG analyses. Thermogravimetric analysis revealed enhanced thermal stability in nanocomposites relative to pristine polyamides. While decomposition onset occurred near 200°C across all formulations, EpGO incorporation significantly improved thermal resistance, evidenced by altered degradation pathways and higher residual char yields at ∼890°C (∼7.93% for GPA‐1 vs. ∼15.06% for PA‐1; ∼3.97% for GPA‐2 vs. ∼17.09% for PA‐2). Slower degradation rates at elevated temperatures further confirmed this stabilization. TCL‐based nanocomposites demonstrated superior thermal behavior compared to ICL‐based systems. The enhanced thermal performance originates from strengthened interfacial interactions and restricted polymer chain mobility imparted by EpGO dispersion. These findings demonstrate that oxirane‐functionalized graphene effectively modulates aromatic polyamide degradation behavior through interfacial engineering. Future research should address mechanical properties and application‐specific functional performance to advance these thermally robust polymer systems toward practical implementation.