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A series of copper(I) amidinates of the general type (R‘NC(R)NR‘ ‘)Cu2 (R‘ and R‘ ‘ = n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl; R = methyl, n-butyl) have been synthesized and characterized. These compounds are planar dimers, bridged by nearly linear N−Cu−N bonds. Their properties (volatility, low melting point, high thermal stability, and self-limited surface reactivity) are well-suited for atomic layer deposition (ALD) of copper metal films that are pure, highly conductive, conformal, and strongly adherent to substrates.
Li et al. (Thu,) studied this question.