Two dimensional curve shape primitives for detecting line defects in silicon wafers

A new set of two-dimensional curve shape primitives for detecting line defects on wafers in semiconductor manufacturing is presented. A supervised learning based neural network which incorporates these shape primitives has been built and tested on more than six months of real data from an Intel fabrication laboratory. Results demonstrate that the new set of shape primitives was very accurate in capturing the line defects.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>