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Study enhances tunneling electroresistance and endurance in ferroelectric junctions, suggesting a path for reliable memory devices.
Ferroelectric tunnel junctions (FTJs) enable nondestructive readout using an ultrathin ferroelectric tunneling barrier, offering excellent scalability and ultralow switching energy for nonvolatile memory or in-memory computing. However, their practical implementation remains hindered by the rapid degradation of tunneling electroresistance (TER) during repeated cycling, which is often accelerated by grain boundary-assisted leakage and oxygen vacancy (V o )-induced interfacial degradation in ultrathin HfO 2 -based ferroelectrics. Here, we simultaneously improve TER and endurance in Hf 0.5 Zr 0.5 O 2 (HZO)-based FTJs by combining an oxide bottom electrode with an oxide interfacial layer at the top electrode to enable domain engineering and provide an oxygen reservoir. An Nb-doped SrTiO 3 (NSTO) [001] bottom electrode promotes a large-grained HZO microstructure, strengthening polarization-controlled tunneling. In addition, a Co top electrode spontaneously forms a CoO x interlayer that serves as an efficient oxygen exchange pathway, suppressing asymmetric V o accumulation during cycling. The resulting Au/Co/HZO/NSTO FTJ exhibits a giant TER of ≈ 1.36 × 10 7 and a large read margin, maintaining stable switching up to10 6 cycles with a read window on the order of 10 4 . These results highlight the synergistic roles of ferroelectric domain control and interfacial oxygen vacancy regulation, offering a viable route toward scalable and reliable ferroelectric tunneling devices based on ultrathin HZO.
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Ha et al. (2026) studied this question.
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