Thermo‐sensitive polymers, which are capable to exhibit a dual‐, triple‐, or multi‐shape effect or a temperature‐memory effect (TME), characterized by a controlled shape change in a predefined way, are of current technological interest for designing and realization of actively moving intelligent devices. Here, the methods for the quantitative characterization of shape‐memory effects in polymers and recently developed thermomechanical modeling approaches for the simulation of dual‐, triple‐, and multi‐shape polymers as well as materials that exhibit a TME are discussed and some application oriented models are presented. Standardized methods for comprehensive quantification of the different effects and reliable modeling approaches form the basis for a successful translation of the extraordinary achievements of fundamental research into technological applications.
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Heuchel et al. (2013) studied this question.
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