What question did this study set out to answer?

This research aims to develop a system for monitoring thermal processes in material extrusion to enhance layer adhesion.

July 4, 2026Proceedings of the Design Society1 citationsOpen Access

Thermal process monitoring for layer adhesion by tracking nozzle position in material extrusion

JDJulie DupasNorwegian University of Science and Technology CEChrister W. ElverumNorwegian University of Science and Technology SSSean H. SassonNorwegian University of Science and Technology

Key Points

This research aims to develop a system for monitoring thermal processes in material extrusion to enhance layer adhesion.
Implemented a Python-based infrared thermography system on a desktop printer.
Tracked nozzle movements and measured temperatures ahead of deposition.
Quantified accuracy based on camera distance (Δd=73mm) and probe radius (R2-R5).
The optimal probe distance was found at R3 with a ΔRMSE of 1.52°C.
The thermal monitoring results indicate potential improvements in load-bearing mechanical properties.

Abstract

ABSTRACT: We present a thermal process-monitoring system for MEX tracking layer temperature as a proxy for interlayer adhesion. Python-based hottest-point tracking by infrared thermography is implemented on a chamber-heated desktop printer to track nozzle movements and measure the temperature field millimeters ahead of deposition logging the results on a CSV file. We quantify accuracy versus camera distance (Δd=73mm) and probe radius (R2-R5). Where R3-R4 provided just a ΔRMSE of 1.52°C suggesting R3 as the optimal distance. The results can inform mechanical properties in load-bearing AM applications.

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