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Abstract The complex interactions between abrasives and workpieces across both spatial and temporal dimensions, the difficulty in quantitatively characterizing material removal under ductile–brittle coexistence, and the uncertainty in the material removal behaviors associated with internal defects pose significant challenges in dynamic force modeling involved in grinding of hard and brittle solids. To resolve the above issues, a theoretical model of the dynamic grinding force involved in the grinding of B 4 C ceramics was developed by comprehensively considering the time evolution, strain rate effect, random abrasive distribution, multi-abrasive coupling effect, material removal behavior under ductile–brittle coexistence, plastic pile-up, and defect distribution. The simulation results of the model demonstrated a strong correlation with the experimental findings, with an average error of less than 10%. This model elucidated the comprehensive influence of multi-abrasive coupling in the spatial dimension and material damage accumulation in the temporal dimension on the evolution behaviors of grinding forces, thereby enabling the simultaneous capture of both the time-domain and frequency-domain characteristics of grinding force signals. A systematic analysis of the waveform features and spectral components enabled the clear characterization of transient dynamic responses during the grinding process, thereby facilitating the identification of material removal modes. The findings demonstrated that B 4 C ceramics were characterized by high-frequency force signals originating from brittle fractures, with a concomitant reduction in grinding force observed as the size and density of internal defects increased. This study not only enhances the understanding of the mechanisms underlying multi-abrasive interactions and their influence on material removal behaviors but also quantitatively characterizes the effects of grinding parameters and the distribution of defects on grinding forces, thereby providing a theoretical foundation for optimizing the grinding processes of hard and brittle materials.
Wei et al. (Thu,) studied this question.