Polymer design for thermally stable polyimides with low dielectric constant

We successfully prepared a series of thermally stable polyimides (PIs) with low dielectric constant ( k ) by introducing bulky diphenyl fluorenylidene moieties in backbone. The lowest k was found to be 2.77 among non‐fluorinated PIs and 2.35 among fluorinated ones. In order to prove the lowest limit of k in PIs, we prepared soluble and thermally stable polyarylenes (PArs) without polar imide linkage with the same aromatic moieties by coupling polymerization. The lowest k was 2.7 without fluorine (F) and 2.2 with F atom, which showed also promising for low k materials. From these results, PIs we prepared were estimated to the lowest k values among PIs. On the basis of statistics on these results, we could express contour lines of k as a function of imide concentration and F content with high correlation factor (r= 0.96) in PIs and PArs.