High-Flexible Phase Change Composites with Enhanced Thermal Conductivity for Electronic Thermal Management

High thermal conductivity and outstanding flexibility are highly desired for thermal management applications of phase change materials (PCMs) in flexible and wearable electronics. Herein, a shape-stabilized and flexible phase change composite film with binary heat-conducting fillers of boron nitride and graphene nanoflakes was prepared by a facile strategy through a water-based emulsion blending method. Benefiting from the honeycomb-like distribution of binary fillers in polymer-based flexible PCMs, the as-prepared composite exhibits a high thermal conductivity of 1.09 W/m·K and an outstanding extensibility (275%). Meanwhile, it also possesses relatively high latent heat (96.88 J/g) and good thermal and shape stability. Based on the remarkable comprehensive performances, the obtained honeycomb-like structured composite PCM films show great prospects in the thermal management of next-generation flexible electronics.